JPH0519314B2 - - Google Patents

Info

Publication number
JPH0519314B2
JPH0519314B2 JP19654588A JP19654588A JPH0519314B2 JP H0519314 B2 JPH0519314 B2 JP H0519314B2 JP 19654588 A JP19654588 A JP 19654588A JP 19654588 A JP19654588 A JP 19654588A JP H0519314 B2 JPH0519314 B2 JP H0519314B2
Authority
JP
Japan
Prior art keywords
reinforcing plate
flexible
soldering land
flexible board
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP19654588A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0244793A (ja
Inventor
Takahiro Manabe
Yasuto Osada
Toshuki Kawaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP19654588A priority Critical patent/JPH0244793A/ja
Publication of JPH0244793A publication Critical patent/JPH0244793A/ja
Publication of JPH0519314B2 publication Critical patent/JPH0519314B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof

Landscapes

  • Structure Of Printed Boards (AREA)
JP19654588A 1988-08-05 1988-08-05 電子回路装置 Granted JPH0244793A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19654588A JPH0244793A (ja) 1988-08-05 1988-08-05 電子回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19654588A JPH0244793A (ja) 1988-08-05 1988-08-05 電子回路装置

Publications (2)

Publication Number Publication Date
JPH0244793A JPH0244793A (ja) 1990-02-14
JPH0519314B2 true JPH0519314B2 (en]) 1993-03-16

Family

ID=16359523

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19654588A Granted JPH0244793A (ja) 1988-08-05 1988-08-05 電子回路装置

Country Status (1)

Country Link
JP (1) JPH0244793A (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008263122A (ja) * 2007-04-13 2008-10-30 Oki Electric Ind Co Ltd 光モジュール装置

Also Published As

Publication number Publication date
JPH0244793A (ja) 1990-02-14

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